A hybrid integrated circuit, HIC, hybrid microcircuit, or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors and diodes) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB).

Sheet metal embossing is a stamping process for producing raised or sunken designs or relief in sheet metal.

Boriding, also called boronizing, is the process by which boron is introduced to a metal or alloy.

Sintering is the process of compacting and forming a solid mass of material by heat or pressure without melting it to the point of liquefaction.

Phosphate coatings are used on steel parts for corrosion resistance, lubricity, or as a foundation for subsequent coatings or painting.

Transfer molding (BrE moulding) is a manufacturing process where casting material is forced into a mold. Transfer molding is different from compression molding in that the mold is enclosed [Hayward] rather than open to the fill plunger resulting in higher dimensional tolerances and less environmental impact.

Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver (to make silver-gilt), by chemical or electrochemical plating. This article covers plating methods used in the modern electronics industry; for more traditional methods, often used for much larger objects, see gilding.